报告题目: Electrical Discharge Machining of Reaction Bonded Silicon Carbide
报 告 人: Dr. Liew Pay Jun, Universiti Teknikal Malaysia Melaka (UTeM)
报告时间：2018年6月13日上午9:00
报告地点：机械制造系712会议室（机械材料馆）
欢迎从事超精密加工、非传统加工方向的老师和员工参加。同时，Dr. Liew Pay Jun是其所在大学的国际交流中心副主任，也欢迎对出国学习和交流感兴趣的师生参加。
报告人简介：
Dr. Liew Pay Jun, Deputy Director of International Centre, UTeM. Liew Pay Jun received her B.Eng Mechanical (Manufacturing) Engineering from Kolej Universiti Teknologi Tun Hussein Onn in 2006 and M.Sc. Manufacturing Systems Engineering from Coventry University, UK in 2007. Later in 2013, she completed her Ph.D in Mechanical Systems and Design from Tohoku University, Japan. She is now the Deputy Director of International Centre at Universiti Teknikal Malaysia Melaka (UTeM). Her research works include micro/nano machining, non-traditional machining and nanofluid assisted machining.
